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PCB线路板设计中专业英译术语之基材
来源:百能网 | 作者:jiehao | 发布时间: 2176天前 | 2096 次浏览 | 分享到:
PCB设计中专业英译术语之基材:
  1. 基材:base material
  2. 层压板:laminate
  3. 覆金属箔基材:metal-clad bade material
  4. 覆铜箔层压板:copper-clad laminate (CCL)
  5. 单面覆铜箔层压板:single-sided copper-clad laminate
  6. 双面覆铜箔层压板:double-sided copper-clad laminate
  7. 复合层压板:composite laminate
  8. 薄层压板:thin laminate
PCB设计中专业英译术语之基材: 
  1. 基材:base material 
  2. 层压板:laminate 
  3. 覆金属箔基材:metal-clad bade material 
  4. 覆铜箔层压板:copper-clad laminate (CCL) 
  5. 单面覆铜箔层压板:single-sided copper-clad laminate 
  6. 双面覆铜箔层压板:double-sided copper-clad laminate 
  7. 复合层压板:composite laminate 
  8. 薄层压板:thin laminate 
  9. 金属芯覆铜箔层压板:metal core copper-clad laminate 
  10. 金属基覆铜层压板:metal base copper-clad laminate 
  11. 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film 
  12. 基体材料:basis material 
  13. 预浸材料:prepreg 
  14. 粘结片:bonding sheet 
  15. 预浸粘结片:preimpregnated bonding sheer 
  16. 环氧玻璃基板:epoxy glass substrate 
  17. 加成法用层压板:laminate for additive process 
  18. 预制内层覆箔板:mass lamination panel 
  19. 内层芯板:core material 
  20. 催化板材:catalyzed board ,coated catalyzed laminate 
  21. 涂胶催化层压板:adhesive-coated catalyzed laminate 
  22. 涂胶无催层压板:adhesive-coated uncatalyzed laminate 
  23. 粘结层:bonding layer 
  24. 粘结膜:film adhesive 
  25. 涂胶粘剂绝缘薄膜:adhesive coated dielectric film 
  26. 无支撑胶粘剂膜:unsupported adhesive film 
  27. 覆盖层:cover layer (cover lay) 
  28. 增强板材:stiffener material 
  29. 铜箔面:copper-clad surface 
  30. 去铜箔面:foil removal surface 
  31. 层压板面:unclad laminate surface 
  32. 基膜面:base film surface 
  33. 胶粘剂面:adhesive faec 
  34. 原始光洁面:plate finish 
  35. 粗面:matt finish 
  36. 纵向:length wise direction 
  37. 模向:cross wise direction 
  38. 剪切板:cut to size panel 
  39. 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 
  40. 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 
  41. 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 
  42. 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 
  43. 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates 
  44. 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates 
  45. 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates 
  46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 
  47. 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates 
  48. 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates 
  49. 超薄型层压板:ultra thin laminate 
  50. 陶瓷基覆铜箔板:ceramics base copper-clad laminates 
  51. 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates